• 322-328 N 9th St.
    Terre Haute, IN 47807
  • 812-234-1569
  • www.ind-supply.com

3M™ 048011-57011 Thermally Conductive Interface Pad, 300 mm L x 210 mm W, 0.5 mm THK, Silicon Adhesive, Silicon Rubber Backing, White

  • Item Code: 3M 048011-30775
  • Brand: 3M
  • Mfg Part No: 048011-57011
  • Manufacturer: 3M
  • Unit Size: 1
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Description

3M™ thermally conductive silicone interface pad (TCSIP) 5591 is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M™ TCSIP 5591 consists of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles, which helps provides enhanced thermal conductivity and excellent electrical insulation performance.

Features Tech Specs Applications

Features

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    • Good thermal stability of the base polymer with excellent softness of the thermal pad
    • Good thermal conductivity in a ultra soft silicone polymer base
    • The product tack is such that a mechanical means to support the pad in a final assembly is required

Tech Specs

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Adhesive Material Silicon
Backing Material Silicon Rubber
Color White
Dielectric Strength 8
Length 300
Maximum Operating Temperature 125
Thickness 0.5
Type Thermally Conductive
UPC 04801130775
Weight (LBS) 0.02
Width 210

Applications

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For integrated chip (IC) packaging heat conduction, heat sink interface, chip on film (COF) heat conduction, LED board thermal interface material (TIM), HDTV integrated chip (IC) and general gap filling in electronic device

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